Wetting Solution Liquid Flux No-Clean 1 OZ Bottle Kit (OMPAC C-5 Reballing Fluid) 6 pack | Part#8200-1330

This low-viscosity liquid flux is formulated for applications that need controlled wetting and penetration beneath components. Capillary action draws it into tight spaces to cover solder balls and pads, including areas that are difficult to reach directly.

The solution supports fast, consistent wetting, smooth solder flow, and reliable joint formation. It helps reduce bridging, solder balling, non-wet conditions, and incomplete reflow. It is suited to reflow repair where even heat transfer and solder activation matter.

Its low-solids, no-clean chemistry leaves minimal clear residue described as nonconductive and noncorrosive. That is useful for BGAs and dense assemblies where cleaning underneath parts is difficult. When cleaning is needed, use a standard flux cleaner or isopropyl alcohol.

• Low-viscosity liquid wicks beneath BGA and fine-pitch components.
• Promotes consistent wetting and dependable solder joints.
• Helps reduce bridging, balling, non-wetting, and incomplete reflow.
• Minimal, clear, nonconductive, noncorrosive no-clean residue.
• Supports improved first-pass yield during repair and rework.

• BGA reballing and solder sphere attachment
• BGA reflow repair and touch-up
• Under-component fluxing on dense PCB assemblies
• Fine-pitch SMD and microelectronics rework

Processes: Hot air rework systems, IR and convection reflow, hand soldering, and touch-up.

Methods: Use the included dropper for precise dispensing, apply at a component edge to encourage capillary flow, or brush onto a localized area.

Compatibility: Lead-free and tin-lead solder alloys; common PCB surface finishes including ENIG, HASL, and OSP.

Store the bottles in a cool, dry place and keep them tightly sealed between uses. Consult the product labeling for shelf life and handling guidance.