Programmable Process Control
Microprocessor control allows the operator to create repeatable bonding profiles with programmable temperature set points, ramp rates, and timed cycles. Temperature can be programmed in Celsius or Fahrenheit, with ramp times ranging from 15 seconds in continuous operation to three minutes.
Controlled Pressure and Alignment
Linear pressure control works with a floating, self-aligning bond head and a super-flat bonding surface. This combination helps distribute pressure evenly, maintain alignment, and improve repeatability across heat-seal and flexible-circuit assemblies.
Self-Contained Production Platform
The BondMaster is self-contained and does not require a separate computer or factory-air connection. Pre-stored profile groups, user-programmable settings, continuous or pulse operation, and a thermal bonding reservoir provide a flexible platform for both repair and production work.
