Designed for Data Center Board Rework
APE Flo-Master III — Data Center PCB Rework System
Designed for data center board rework, the APE Flo-Master III brings controlled convection heating, temperature profiling, and timed process control to component-level repair of compatible server, networking, storage, and power-management circuit boards. The standard platform supports small to medium PCB assemblies.
Built around the needs of data center electronics repair, the Flo-Master III supports SMT and BGA component removal and replacement, including lead-free rework. Rework profiles are matched to the board, solder alloy, and component requirements.
Part 5003-6002 • 220V • SMT and BGA Rework
Controlled SMT and BGA Rework
The Flo-Master III supports a broad range of surface-mount components while providing the controlled heating environment needed for professional PCB repair. It is designed for small to medium assemblies and temperature-sensitive rework applications.
Production-Style Convection Heating
Convection hot-air technology reproduces the controlled heating method used during electronics manufacturing. Heat is delivered at an appropriate reflow temperature to protect sensitive components and help limit unnecessary heating of nearby devices.
Lead-Free Rework Capability
Lead-free solder materials require higher reflow temperatures and careful process control. The Flo-Master III provides the convection energy and profiling capability needed to manage these demanding thermal processes.
Simple, Repeatable Operation
Automatic timed process control and selectable thermal BGA profiling help technicians establish a consistent workflow for component removal and installation.
Key Features
- ✓ Professional 220V rework system
- ✓ SMT and BGA component capability
- ✓ Profile temperature control
- ✓ High-power convection heating
- ✓ Automatic timed process control
- ✓ Selected thermal BGA profiling
- ✓ Suitable for lead-free rework
- ✓ Small to medium PCB assemblies
- ✓ 12-month manufacturer warranty
Product Details
| Manufacturer |
APE |
| Product |
Flo-Master III Rework System |
| APE Part Number |
5003-6002 |
| Input Voltage |
220V |
| Primary Applications |
SMT and BGA component rework |
| Recommended Board Size |
Small to medium PCB assemblies |
| Heating Method |
Convection hot air |
| Process Control |
Automatic timed control |
| Profiling |
Selected thermal BGA profiling |
| Warranty |
12 months |
✓
Professional Convection Rework Platform
Part 5003-6002 combines controlled convection heating, timed operation, and BGA profiling for professional 220V SMT rework applications.
Designed for Data Center Board Rework
Designed for data center board rework, the Flo-Master III provides controlled convection heating and timed process control for component-level SMT and BGA repair.
Rework profiles are matched to the board, solder alloy, and component requirements. Contact APE to confirm your specific application.
Data Center Board Repair Applications
| Server and management boards |
Component-level SMT repair on compatible server control, monitoring, and support circuitry. |
| Networking and interface boards |
Selected component removal and replacement on compatible network adapters, interface cards, and switch support boards. |
| Storage and controller boards |
SMT component repair on compatible storage controllers and associated support boards. |
| Power-management circuitry |
Replacement of compatible surface-mount power devices and control components following fault diagnosis. |
| BGA devices |
Controlled removal and replacement of compatible BGA components using an application-specific thermal profile. |
A Rework Process Matched to Your Board
Each board and component has its own heating requirements. Nozzle selection, temperature profile, heating time, and board support are matched to the repair. APE can review your board dimensions, component details, and process requirements to help confirm the appropriate application.
Discuss Your Data Center Board Application
Speak with an APE application specialist about your server, networking, storage, or power-management board. Provide board dimensions, component details, and repair requirements for an application review.
Call 800-822-8646
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