Flowmaster III 220V | Part#5000-1000

Controlled SMT and BGA Rework

The Flo-Master III supports a broad range of surface-mount components while providing the controlled heating environment needed for professional PCB repair. It is designed for small to medium assemblies and temperature-sensitive rework applications.

Production-Style Convection Heating

Convection hot-air technology reproduces the controlled heating method used during electronics manufacturing. Heat is delivered at an appropriate reflow temperature to protect sensitive components and help limit unnecessary heating of nearby devices.

Lead-Free Rework Capability

Lead-free solder materials require higher reflow temperatures and careful process control. The Flo-Master III provides the convection energy and profiling capability needed to manage these demanding thermal processes.

Simple, Repeatable Operation

Automatic timed process control and selectable thermal BGA profiling help technicians establish a consistent workflow for component removal and installation.

Key Features

• ✓Professional 220V rework system
• ✓SMT and BGA component capability
• ✓Profile temperature control
• ✓High-power convection heating
• ✓Automatic timed process control
• ✓Selected thermal BGA profiling
• ✓Suitable for lead-free rework
• ✓Small to medium PCB assemblies
• ✓12-month manufacturer warranty

Professional Convection Rework Platform

Part 5000-1000 combines controlled convection heating, timed operation, and BGA profiling for professional 220V SMT rework applications.

Need Help with the Flo-Master III?

Speak with an APE application specialist about your PCB, component sizes, profiling requirements, and available rework options.