Controlled SMT and BGA Rework
The Flo-Master III supports a broad range of surface-mount components while providing the controlled heating environment needed for professional PCB repair. It is designed for small to medium assemblies and temperature-sensitive rework applications.
Production-Style Convection Heating
Convection hot-air technology reproduces the controlled heating method used during electronics manufacturing. Heat is delivered at an appropriate reflow temperature to protect sensitive components and help limit unnecessary heating of nearby devices.
Lead-Free Rework Capability
Lead-free solder materials require higher reflow temperatures and careful process control. The Flo-Master III provides the convection energy and profiling capability needed to manage these demanding thermal processes.
Simple, Repeatable Operation
Automatic timed process control and selectable thermal BGA profiling help technicians establish a consistent workflow for component removal and installation.
