The Flo-Master III system is a reliable SMT Component PCB rework and repair system, suitable for small to medium PCB assemblies and BGA and SMT components requiring Profile Temperature Control.
Wide Ranging
The Flo-Master III PCB repair system covers a wide range of SMT components, providing a controlled PCB rework environment that supports your repair process. The system features simple operation, automatic timed process control, and selected thermal BGA profiling.
Energy Rework Reflow
What makes the Flo-Master II different from other Hot Air SMT rework machines is convection power. Its high-power heater reworks sensitive components at original Convection Oven temperatures.
Lead-Free Rework
Oven Temperature Convection Rework is critical when reworking lead-free components. The SMT component reflow temperature is higher for lead- free materials, but the heat source should be kept to an optimum convection temperature to avoid damaging surrounding SMT components. Replicating the manufacturing method using a convection hot air reflow technology is the safest method
Flowmaster III 220V
APE Part#5000-1000
