Chipmaster-Z Axis 220V Radiant RAD-6000-Z for Large PCB's and SMT Components | Part#8000-0010-Z

Wide-Area Board Preheating

The RAD-6000-Z provides 144 square inches of digitally controlled radiant energy. Its broad 12 × 12-inch heating surface gradually and uniformly stabilizes the circuit board before and during component rework.

Helps Control Board Warpage

Large multilayer boards can warp when exposed to concentrated local heating. Total-area radiant preheating reduces temperature differences across the assembly, supporting safer rework of larger PCBs and high-mass boards.

High-Energy, Low-Temperature Rework

When combined with the ChipMaster-Z platform, radiant preheating reduces the thermal demand placed on the top-side rework tool. The system can support work on heat-sensitive plastic components at temperatures below 410°F (210°C), depending on the application and process setup.

Key Features

• ✓ ChipMaster-Z top-side rework system
• ✓ 12 × 12-inch radiant preheater
• ✓ 144 sq. in. radiant heating area
• ✓ Digitally controlled radiant energy
• ✓ ±2°F accuracy after calibration
• ✓ Uniform full-area board stabilization
• ✓ Designed for larger and high-mass PCBs
• ✓ Adjustable Z-axis rework platform
• ✓ 220V, 50Hz CE configuration

Need help configuring the RAD-6000-Z?

Speak with an APE application specialist about board dimensions, component mass, heating requirements, process setup, or replacement accessories.