Production-Style Temperature Profiling
Originally developed with Motorola, the ChipMaster SMD-1000 was designed to reproduce the controlled convection-temperature profile used in production reflow ovens. This helps technicians rework sensitive components without relying on unnecessarily high air temperatures.
Wide-Ranging SMT and BGA Capability
The system supports a broad selection of BGA and SMT packages on small to medium PCB assemblies. Three standard rework nozzles are included, and alternative nozzle sizes may be selected to match specific component dimensions.
Self-Contained Air and Vacuum
An internal blower supplies controlled hot-air flow while an internal vacuum pump supports component handling during removal and replacement. The self-contained design does not require a separate shop-air connection.
Repeatable Process Control
Fuzzy-logic PID temperature regulation, selectable Fahrenheit or Celsius display, automatic timed operation, and thermal BGA profiling help establish a consistent professional rework process.