ChipMaster SMD-1000 115V 1200W | Part# 8100-1003OG

Controlled Convection Rework

Originally developed with Motorola in 1991, the ChipMaster was engineered to reproduce the controlled convection-heating profile used in production reflow ovens. Low-velocity hot air is directed at the selected component to provide focused heating while helping protect nearby parts.

BGA and SMT Applications

The 1,200-watt heating system provides the convection power required for controlled removal and replacement of BGA devices and other surface-mount packages on small and medium PCB assemblies.

Repeatable Process Control

Automatic timed process control and fuzzy-logic PID temperature regulation help technicians maintain a consistent rework cycle. The temperature display is selectable between Fahrenheit and Celsius.

Self-Contained Air and Vacuum

An internal blower supplies the system's hot-air flow, while the built-in vacuum pump supports component handling during removal and replacement. No separate shop-air source is required.

Key Features

• ✓ 1,200-watt convection heating
• ✓ BGA and SMT component rework
• ✓ Automatic timed process control
• ✓ Fuzzy-logic PID controller
• ✓ Selectable °F or °C display
• ✓ Air velocity below 12.7 CFM
• ✓ Internal blower and vacuum pump
• ✓ 8 × 8-inch PCB holder
• ✓ Three standard nozzles included
• ✓ SMT Tool Kit 8100-1097 included

Lead-Free Rework Configuration

Lead-free assemblies typically require higher reflow temperatures. A compatible APE bottom-heating system is required for lead-free rework and is not included with this configuration. Contact APE to confirm the correct heater and nozzle setup.

Need help confirming compatibility?

Speak with an APE application specialist about your circuit board, component, nozzle, or bottom-heater requirements.