Chip-Max RoHS Ready Rework Station 220VAC | Part# 8300-34-RoHs

High-Power Convection Rework

The Chip-Max uses convection hot air to reflow components at controlled temperatures similar to the original manufacturing process. This approach supports effective heat transfer while helping protect adjacent components from excessive localized temperature.

Integrated Board Preheating

An integrated 1,200W preheater works with the upper convection heater to deliver 2,400W of total heating power. Preheating helps reduce thermal shock and supports more uniform heating across the PCB during removal and installation.

Profile Temperature Control

Fuzzy-logic PID temperature control and automatic timed operation help the operator manage repeatable thermal processes for BGA and SMT rework. Temperature can be displayed in either Fahrenheit or Celsius.

Compact Benchtop Configuration

The self-contained station includes an internal air blower, internal vacuum pump, and an 8 × 8-inch PCB holder. Its compact format provides professional heating and handling capability without requiring a separate external air source.

Key Features

• ✓ RoHS-ready BGA and SMT rework
• ✓ 2,400W combined heating power
• ✓ Integrated 1,200W PCB preheater
• ✓ Fuzzy-logic PID temperature controller
• ✓ Automatic timed process control
• ✓ Air velocity below 12.7 CFM
• ✓ Internal air blower and vacuum pump
• ✓ Selectable Fahrenheit or Celsius display
• ✓ 8 × 8-inch PCB holder
• ✓ Three standard rework nozzles included

Designed for Lead-Free Rework

The combination of convection heating, integrated board preheating, and PID temperature control provides the controlled thermal environment required for higher-temperature lead-free solder processes.

Need Help Configuring Your Chip-Max?

Speak with an APE application specialist about component sizes, nozzle selection, PCB dimensions, and thermal-process requirements.