Press and hold SET for~ 6 seconds, display will read “modE” (mode of operation) use arrows to select “rAmP”
(Ramp Soak Mode), press and hold set to return to the operator display.

Mode : Ramp

1. Place work into board holder securely.

2. Press SET key once to see pattern “Ptrn” The machine will store 4 different ramp/soak profiles.  
Select either 1,2,3, or 4 using the up and down arrows, press SET once to select, once more to return to operator screen.  

Example of profile setup:
3. Press and hold set for 2 seconds to see L1-1. This is the temperature setting for segment 1, use up or
down arrow to reach 150 and press SET.  

Display now reads T1-1  This is the time to reach 150, use arrows to set at 1.00 (1 minute), press SET.
Display now reads L1-2  This is the temperature seting for segment 2, use arrows to set at 150 set.
Display now reads T1-2  This is the time to dwell or soak at 150, use arrows to set at .30 (30 seconds) press SET

Display now reads L1-3  (Temp for segment 3) use arrows, set at 250, press SET.
Display now reads T1-3  (Time for segment 3) use arrows, set at .15 (15 seconds) press SET
Display now reads L1-4  (Temperature for Segment 4) use arrows, set at 250, press SET
Display now reads T1-4  (Time for Segment 4) use arrows, set at 1.00 (1 minute), press SET

Display reads “EndP” (End of pattern) Press and hold set to return to the operator screen.
This ends the creation of a 4 zone (or segment) profile. **

** If you wish to have more segments in the profile, you can program pattern 2 to be continuation of the pattern,
and when you are at the “EndP” ( End of pattern) display, change to 2 and press set.  This will make the machine
run pattern 1, and then pattern 2 immediately after, essentially giving a possibility of 8 segments or zones in
the profile.

4.  Press up and down arrow at same time to reset timer to zero.

5. Set the nozzle height to 1/8″ to 1/4″ above the IC to be repaired.  

6. Turn on Vacuum, depress vacuum pickup until it contacts and holds the component

7. Press and hold the foot pedal for two seconds, then release.  The heating will begin, and a time will count
downwards fo each segment or zone.  After the segments are completed the machine will stop and cool down.

8. After a period of cooling, move the work out from under the nozzle, an remove the component lifted by turning
off vacuum and using tweezers to grasp component from vacuum cup.

9. For BGA: Remove all solder from pads using a soldering iron and solder wick, or solder braid, then clean well.
    For other SMDs: Use a soldering iron to add solder to the pads equally and then clean well.

10. Add a small amount of flux paste to the pad area, being sure that some flux is on all the pads.  Use the brush
to spread the flux over the area.

11. Place the component on the board, being very careful in the alignment to the pads.

12. Move the work beneath the nozzle and center it.

13. Press and hold the foot pedal for 2 seconds and release, the temperature will go up on the display,and the machine will run the programmed profile and automatically stop and cool down at the end.

14. Allow work to cool

15. MOve work from beneath nozzle

16. Use flux remover to clean the area of the repair..

*** If at any time you wish to cancel the operation, press the <RS key and hold for two seconds, this will stop
the machine operation.