A proven bonding repair and production system for Liquid Crystal Display, which are bonded by Heat Seal Connector contacts (HSC) or Reflow Solder contacts, as used in Pagers, Portable Radios, PCMCIA and PCS devices.
A closed-loop system continually compensates for “Set Point” of temperature drop and overshoot, which is accomplished by a centrally located, low mass (fast response) thermocouple sensor, located directly within the Hot Bar.
The close tolerance temperature control eliminates thermal stress, delamination and heat degradation, providing a major advantage in the reliability of the bonded components.
The BondMaster uses a self-aligning, free-floating Bond Head (Hot Bar Thermode), which is optomized by a Temperature Controller providing accurate and reliable temperature-time cycle control.
Bonding Thermal Stability
Uniform heat distribution throughout the Hot Bar is critical in ensuring a reliable bond.
Indgredients for a Successful Bond
Time, Temperature, and Profile are controlled by the PID Controller, which stores the correct program for the bond.
Pressure is applied by a calibrated tension, maintained by a Bearing Carriage and determined by a Thumb Wheel Adjuster. A Locking Pin protects against intervention.
Once the subject is in place under the Bond Head and the pressure adjusted by the Thumb Wheel, the Bond Head is placed in position by a Locking Lever, which will remain until the bond time is completed.
- HSC, Mylar, PCMCIA, Flexible Circuit connections
- Microprocessor controlled
- Self-contained, no PC or factory air required
- Linear pressure control
- Precise temperature control and profiling
- Repeatable process control
- Continuous or pulse operation
- Pre-stored profile groups
- User programmable
- Floating and self-aligning Bond Head
- Thermal bonding reservoir
- “Super Flat” bonding surface
- Thermal stability throughout bonding cycle
- No silicone barrier required
APE also offers video narrated trials to help in the evaluation process, our lab technicians will perform your job and return the completed work with the video.
enlarge photo (Picture 2)
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APE Part# Motorola Part# Description
9000-1000 R1346A BondMaster 60Hz 110V
9000-1002 R1347A BondMaster 50Hz 220V
9000-1010 0180304E22 Universal Bonding Fixture
8200-1370 0180304E25 HSC Bond Tape, 3 pack
8200-1360 0180304E72 HSC Bond Tape, 6 pack
The BondMaster has been engineered to enable rapid interchange of differing product assemblies, not only for Pager products listed but also for producttion assembly of LCD and Flexible Circuits.
We are pleased to offer advice in developing a Fixture. However in order to keep costs to a minimum we suggest that our customers use either in-house or local facilities to fabricate fixture requirements.